TLP headers in PCIe 6.0; AL/ML in functional verification; generative AI pilot; virtual twins for semi R&D; III-V tech.

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 ...

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.

Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna.

The top three foundries plan to implement high-NA EUV lithography as early as 2025 for the 18 angstrom generation, but the replacement of single exposure high-NA (0.55) over double patterning with ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. Abstract ...