Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling ...
This application note provides design and manufacturing guidance in the use of the lead frame chip scale package (LFCSP). The LFCSP is compliant with JEDEC MO220 and MO229 outlines. The LFCSP is a ...
This search allows entry of orderable integrated circuit model numbers to find associated material compositions with related environmental product data such as RoHS, REACH and other substance ...
One common method for determining the tilt or inclination of a system is to integrate the output of a gyroscope. Although this method is straightforward, error ...
Download the FREE ADI DiffAmpCalc™ for designing differential amplifier circuits and reduce design time from hours to minutes! The tool is easy to use and features an interactive user interface to ...